- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
Patent holdings for IPC class H05K 7/02
Total number of patents in this class: 1605
10-year publication summary
193
|
184
|
113
|
132
|
136
|
145
|
121
|
70
|
57
|
16
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Z124 | 352 |
79 |
Yazaki Corporation | 6282 |
41 |
Samsung Display Co., Ltd. | 30585 |
38 |
Samsung Electronics Co., Ltd. | 131630 |
35 |
Apple Inc. | 50209 |
29 |
Sumitomo Wiring Systems, Ltd. | 9367 |
24 |
LG Electronics Inc. | 69257 |
21 |
Hitachi Astemo, Ltd. | 5618 |
19 |
Huawei Technologies Co., Ltd. | 100781 |
17 |
Wistron Corporation | 2270 |
17 |
Eaton Intelligent Power Limited | 6113 |
17 |
Intel Corporation | 45621 |
16 |
Sumitomo Electric Industries, Ltd. | 14131 |
14 |
Murata Manufacturing Co., Ltd. | 22355 |
14 |
Cilag GmbH International | 5813 |
14 |
Robert Bosch GmbH | 40953 |
13 |
Boe Technology Group Co., Ltd. | 35384 |
13 |
AutoNetworks Technologies, Ltd. | 5809 |
13 |
Denso Corporation | 23338 |
12 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
12 |
Other owners | 1147 |